Electronic component, especially a microwave HBT useful for air traffic control radar equipment, has device layer stacks and similar pads for heat conduction from a flat top heat dissipation element to a bottom substrate

摘要

An electronic component, having device layer stacks and similar pads for heat conduction from a flat top heat dissipation element to a bottom substrate, is new. An electronic component comprises a substrate bearing a first layer stack of mesa shape and an overlying contact layer coated with an electrically and thermally conductive layer on which is mounted a heat dissipation element. The heat dissipation element has a flat shape and the component includes at least one pad consisting of a second similar layer stack also coated with the electrically and thermally conductive layer on which the heat dissipation element is also mounted for conducting heat from the dissipation element towards the substrate. An Independent claim is also included for a heterojunction bipolar transistor production process. Preferred Features: The heat dissipation element is a diamond sheet brazed to the layer stacks and the pads by a tin brazing alloy.