CIRCUIT BOARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a circuit board constituted such that high connection reliability can be ensured and a method of manufacturing the same. SOLUTION: This circuit board 1 is constituted such that wiring patterns coated on the surfaces of a substrate material 2 are conductively connected to each other via conductive power 4 filled in a through hole. The conductive powder 4 filled in the through hole is welded to each other and also to the wiring patterns 3. This method of manufacturing the circuit board 1 includes the step of heating the substrate material 2 and metal foil while compressing them in the thickness direction and applying a high-voltage current between the wiring patterns 3 made of the metal foil. Or, this method includes the step of heating the substrate material 2 and metal foil while compressing them in the thickness direction and applying a high-voltage current between the metal foils at the same time before forming the wiring patterns 3 made of the metal foil.