| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor wafer, where a processing load can be lessened in a chamfering process, and all the surfaces of all wafers are conformed to a prescribed crystal plane when ingot materials are collectively sliced into wafers. SOLUTION: In a cylinder grinding process, a silicon ingot block 10 is ground into a cylinder with a grinding wheel 11 around an axis (a) which extends in the same direction with a required crystal orientation, when a single crystal silicon ingot is grown in crystal. As a result, if the ground ingot cylinder is sliced at a right angle with the axis (a), all silicon wafers become all true circles each possessed of a front and a rear surface in parallel with a required crystal plane (100). Therefore, a silicon wafer is not required to be previously rounded in a chamfering process, so that a processing load can be lessened in a chamfering process. When ingot materials are collectively sliced, the surfaces of all wafers are conformed to a prescribed crystal plane.
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