| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for mounting and soldering components with which a component can be mounted with high accuracy, the quantity of nitrogen to be sprayed can be reduced, and high-quality soldering can be performed when a component is mounted on a printed board. SOLUTION: A tapered pin is vertically moved by a motor drive to control to open and close a chuck pawl 3 for chucking a component 1. On the other hand, for soldering, a nitrogen chamber filled with nitrogen is constituted and the chuck pawl 3 chucking the component is inserted into an insert port of a cap of the nitrogen chamber. When the nitrogen is filled in the chamber and the oxygen concentration becomes a certain level or less, solder is heated and melted. While the chuck pawl 3 is chucking the component 1 on a work, rubbing operation is performed during soldering. |
