发明名称 COOLING DEVICE OF HEAT GENERATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device of a heat generating substrate which is excellent in life. SOLUTION: The cooling device 10 of a heat generating substrate has a frame body 11 enclosing a heat generating substrate 20. Two cooling fans 12a, 12b are fixed opposite to each other to the frame 11 so that they tilt in the range of 1 deg. or more to less than 90 deg. to the heat generation substrate 20, respectively. A switch circuit 13 which makes the two cooling fans 12a, 12b operate alternately at a proper time interval is connected to the two cooling fans 12a, 12b.
申请公布号 JP2000323879(A) 申请公布日期 2000.11.24
申请号 JP19990131876 申请日期 1999.05.12
申请人 TOSHIBA CORP 发明人 OMORI AKIMITSU
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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