| 摘要 |
PROBLEM TO BE SOLVED: To facilitate wirings between lead frame electrodes and pad electrodes, even if there are fine pitches for the lead frame electrodes, and to reduce layout area in a semiconductor substrate. SOLUTION: In a semiconductor integrated device having a lead frame for connecting pad electrodes H1-H22 on a semiconductor substrate to the outside, connection is made between first lead frame electrodes to be outer pins E1-E22 and the pad electrodes through at least one second lead frame electrode, and connection is made between first pad electrodes and second pad electrodes on the semiconductor substrate via at least one lead frame electrode. |
