发明名称 SOCKET FOR PIN GRID ARRAY PACKAGE AND TERMINAL
摘要 PROBLEM TO BE SOLVED: To efficiently conduct a series of works from mounting of a terminal, setting of a slid member, to the assembly of a sliding means. SOLUTION: This socket for a pin grid array package has a base housing 51 having in a grid shape plural terminals 61 capable of electrically engaging with the lead pins of a PGA(pin grid array) package; and a plate-shaped slide cover 52 arranged on the upper side of the base housing 51 and capable of inserting the lead pins; and a sliding means 63 for sliding the slide cover 52. Each terminal 61 arranged in a grid shape in the base housing is pressed against toward the bottom from the top of the base housing 51 and fixed to a terminal receiving cavity 60 formed on the top surface of the base housing 51, a tail 62 capable of surface soldering installed in the terminal 61 is passed through a passing hole formed in the bottom of the terminal receiving cavity 60 and faced to the lower part than the bottom of the base housing 51.
申请公布号 JP2000323251(A) 申请公布日期 2000.11.24
申请号 JP19990121051 申请日期 1999.04.28
申请人 MOLEX INC 发明人 MIZUMURA AKINORI;OKANO MASAHITO
分类号 H01R13/11;H01L23/32;H01R13/193;H01R13/24;H01R13/428;H01R24/00;H01R33/76;(IPC1-7):H01R33/76;H01R13/42;H01R24/06 主分类号 H01R13/11
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