| 摘要 |
PROBLEM TO BE SOLVED: To provide a completely packaged noncontact data carrier which is produced by the molding of a single time and also has no section of a lead frame when the data carrier is packaged by the transfer molding. SOLUTION: A lead frame 4 is made of a heat contractible material and a circuit parts 1 consisting of an IC chip and an internal parts 3 consisting of a transmitting and receiving antenna 2 etc., are put on the frame 4. Then the frame 4 having the parts 3 is held at a prescribed position in a cavity of a heated metallic mold and at the same time a sealing resin material such as the softened thermosetting resin is injected into the cavity. This state is held for the time being and the frame 4 is cut when the resin starts to be solidified and the parts 3 is almost solidified. Then the sealing resin material is completely solidified and a sealing resin layer 5 is formed. Thus, a noncontact data carrier is obtained. |
