| 摘要 |
PROBLEM TO BE SOLVED: To enable ultra-thinner structure of a semiconductor package by arranging a semiconductor chip within a through-hole formed on a circuit substrate. SOLUTION: In a circuit substrate 10, a through-hole 18 of a constant size is formed on the area to arrange a semiconductor chip 2, and the semiconductor chip 2 is located at the internal side thereof almost around a resin layer 11 having a first surface 11a and a second surface 11b. The area of through-hole 18 is formed larger than the areas of the first surface 2a or second surface 2b of the semiconductor chip 2. Moreover, many conductive circuit pattern layer including ball land 15 is formed on the first surface 11a of the resin layer 11 at the external side of the through-hole 18. Namely, a conductive circuit pattern layer (material is copper) is formed in sequence of a series of bond fingers 12, coupling part 13 and ball land 15 from the area near the through-hole 18. Thereby, since the semiconductor package can be formed in the ultra-thinner structure and a surface of semiconductor chip can be exposed direct to the external side of the sealing material, heat radiation characteristic can be improved very much. |
