| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high density mutual connection system which can be provided with the desired number of mutual connections by routing a group of related circuit passes connected to the same regions of a group of circuit cards on a second back plane connected to a main back plane. SOLUTION: This system is provided with a plurality, for example, six of second back plane boards 24. Each card connector 16 has three parts, each of which corresponds to one of the second back plane boards 24. The three parts include a central part and two up and down outside parts vertically extended from the central part. Due to this structure, the number of layers of each second back plane board 24 and of a first back plane board 10 can be set within the present manufacturing capacity.</p> |
