| 摘要 |
PROBLEM TO BE SOLVED: To accelerate quick TAT operation for supplying semiconductor produces to customers and allow manufacturing cost to be reduced further. SOLUTION: A prober apparatus for electrically measuring electrical characteristics of a semiconductor chip formed on a semiconductor wafer 3, by contacting probe needle 4 to the chip comprises a conductive board 1 for mounting the wafer 3 and a support 2, which is mounted on the conductive board 1 and composed of a heat insulating material. Such a structure serves to reduce the heat capacity of the semiconductor wafer 3, and a heat source is mounted so that the semiconductor wafer can be quickly set to a prescribed temp.
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