发明名称 MANUFACTURE OF CONTACT FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize a manufacturing method a contact which can block the occurrence of residue at a swelling phenomenon section caused by an interval between gate electrodes different in phases between a cell array region and a peripheral circuit region. SOLUTION: A gate electrode 105 is made on a substrate 101 and is covered with a spacer 107 and a thermal oxide film 109, and then a first interlayer insulating film 114 is made and flattened, and this is patterned and etched and it is filled with a embedding landing pad 117 of polysilicon thereby being flattened. Hereon, a bit line 123 is made, and a third interlayer insulating film 125 is stacked, and etching is made to the landing pad 117, and is filled with a storage electrode 127, and hereon a conductive film 131 and a plate electrode 133 are made.
申请公布号 JP2000323573(A) 申请公布日期 2000.11.24
申请号 JP20000109865 申请日期 2000.04.11
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 BAN HYO-DONG;CHOE HYUN-CHEOL;CHOI CHANG-SIK
分类号 H01L21/28;H01L21/768;H01L21/8242;H01L27/105;H01L27/108 主分类号 H01L21/28
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