| 摘要 |
PROBLEM TO BE SOLVED: To ensure bonding property by bonding to lands before the lands oxidate, in a method of electrically connecting a plurality of IC chips to a circuit board through conductors formed by wire bonding. SOLUTION: This method comprises the steps of forming bumps 6 regarding all lands 4, corresponding to a plurality of IC chips 3 and at a sec. side of wire bonding and a bonding step of wire bonding to form conductors with pads 3a set at a prim. side and the bumps 6 set at the sec. side, and electrically connecting the IC chips 3 to a circuit board 1. Thus, even if a plurality of IC chips 3 are disposed, bonding is made to all the lands 4 and latter lands 4 can be bonded also before oxidating, and hence the bonding property between the lands 4a and bumps 6 is ensured. |
