发明名称 COOLING STRUCTURE FOR ANTENNA DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling system where a VCS(vapor cycle system) is not used in an antenna device which is loaded on an aircraft and which requires cooling to a temperature lower than the temperature of a heat discharge destination. SOLUTION: A skin 2 corresponds to the outer wall of an aircraft and it also constitutes the outer wall of an antenna device with the heat radiation board of the antenna device. A module 4 generates heat for amplifying a signal and requires cooling to a temperature not more than a prescribed temperature. An antenna element 5 radiates the signal amplified by the module 4 into space and is connected to the module 4. Peltier plates 6 are constituted of a semiconductor whose thermoelectric conversion efficiency is large and can obtain a cooling effect by supplying power and they are installed on both ends of the antenna device. The heat generation (heating) side of the Peltier plates 6 are fixed to the skins 2 constituting the outer walls of the antenna device. A base plate 7 mounts two modules 4 on the upper and lower surfaces and both ends of it are fixed to the heat absorbing (cooling) sides of the Pertier plates 6.
申请公布号 JP2000323910(A) 申请公布日期 2000.11.24
申请号 JP19990129464 申请日期 1999.05.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOKUNAGA KENJI
分类号 H01L23/38;H01Q1/00;H01Q1/28;(IPC1-7):H01Q1/00 主分类号 H01L23/38
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