| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and a prepreg which is used in this method, so as to produce a printed circuit board and a semiconductor circuit board which can be thinned with a reduced man-hours and without problems of contamination. SOLUTION: After punching a hole in a substrate, a copper foil is attached to the substrate and hardened by heat. The substrate which is used when producing a semiconductor circuit board having a depression enclosed with a hole wall and a copper foil, used as a bonding pad or a die pad, is set as a prepreg. The matrix resin of the prepreg includes epoxy resin, a curing agent, and a nitrile butadiene rubber containing carboxyl group. The content of the rubber is 5-100 parts by weight to 100 parts by weight of the epoxy resin.
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