| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting device wherein a device element like fusible alloy is accommodated in an insulating case, terminal parts are arranged on the back, and the inner device element is not damaged by infrared ray irradiation when mounting is performed via an infrared ray furnace, i.e., a mounting method is not restricted. SOLUTION: Electrodes 2, 3 are arranged on the surface of an insulating board 1 formed in a black system color, terminal parts 4, 5 connected with the electrodes 2, 3 are arranged on the back, fusible alloy 6 which is to be fused at a specified temperature is connected and fixed to both inside ends of the electrodes 2, 3, as a device element, the fusible alloy 6 is covered with flux 7, and the surface side of the insulating board 1 is covered and sealed with an insulating cap 8 formed in a white system color. Since the insulating cap 8 is formed in the white system color, heat absorption of the insulating cap is small when a mounting method passing an infrared ray furnace is adopted, and the fusible alloy 6 as the device element is not fused erroneously, so that a mounting method is not restricted.
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