ADHESIVE FOR ELECTRONIC DEVICE AND SEMICONDUCTOR PACKAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce coefficient of linear expansion while maintaining viscosity with satisfactory workability, by adding an inorganic filling material with a particle diameter which does not interfere with electrical connection in a flip- chip package. SOLUTION: This adhesive for an electronic device is composed of (A) a thermosetting resin and (B) an inorganic filling material having a particle diameter of 0.1 to 10μm. The adhesive contains (A) 30 to 80 weight % of the thermosetting resin and (B) 20 to 70 volume % of the inorganic filling material. Furthermore, a semiconductor chip is mounted on the semiconductor packaging device using the adhesive for an electronic device.