METHOD FOR FORMING LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a lead frame for preventing generation of non-uniform plating in plating processing by a 'first mask plating + stamping method' or the like. SOLUTION: Guide holes 14 are formed in first pressing at a lead frame material 10, and a plating liquid bank holes 18 are formed at the four corners of a plating region 17. Afterwards, sliver plating is operated to the plating region 17, and then one part of the plating region 17 is formed as a semiconductor chip loading part and a terminal part by second pressing, and the residual part of the plating region 17 reused to form a lead frame.