发明名称 FORMATION METHOD FOR LEAD FRAME
摘要 <p>PROBLEM TO BE SOLVED: To obtain a formation method in which a silver plated part in an inessential part is removed with high accuracy and surely, by a method wherein, after silver plating is executed, the silver plated part which is stuck to the worked end face of a terminal part is electrolytically stripped. SOLUTION: At a stage at which a lead frame is formed, silver plating is executed to a region to be plated. Then, other parts excluding the intermediate part 13c of a terminal part 13 corresponding to an opening part 31a and an opening part 32b in the lead frame are masked with a mask rubber 31 and a mask plate 32. Then, a lead frame blank is positioned by the mask rubber 31 and the mask plate 32 in such a way that a part from which a silver plated part is removed in the lead frame blank is exposed on the lower surface. After the lead frame blank is pressed by a mask rubber 37 and a pressure rubber 38, a DC voltage is applied in such a way that the side of a nozzle becomes a negative pole and that the side of the lead frame becomes a positive pole. A plating removal liquid is introduced from an introduction port under a prescribed pressure, it is spouted by a nozzle 36, and a silver plated part 13b is removed.</p>
申请公布号 JP2000323639(A) 申请公布日期 2000.11.24
申请号 JP19990129698 申请日期 1999.05.11
申请人 NEW JAPAN RADIO CO LTD;NISHIHARA RIKO KK 发明人 ASO SEIJI;ISHIYAMA MASAAKI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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