| 摘要 |
PROBLEM TO BE SOLVED: To surely remove an oxide layer and to improve stability of connection by forming a thin film conductive layer consisting of a conductive material layer and a conductive protective layer formed thereon which is to have an oxide layer of specified thickness or less in the production process. SOLUTION: The coil layer 29 of an inductive head is produced by forming a coil base layer 29b as a laminated product of Ti and Cu on a resist insulating layer 28b formed by a resist, and laminating a Cu layer 29c as a conductive material layer and a Ni layer 29d as a conductive protective layer thereon by a frame plating method. The formation of an oxide layer on the surface of the Ni layer 29d at normal temp. or in a heated atmosphere does not proceed than 3.0 nm thickness, so that the oxide layer can be surely removed by scraping the Ni layer 29d from the surface to >=3.0 nm depth by a dry etching method such as ion milling. By connecting the region where the oxide layer of the Ni layer 29d is removed to a lead layer 32, the adhesion property and electrical continuity are improved.
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