| 摘要 |
PROBLEM TO BE SOLVED: To measure the physical/electrical properties of a board correctly as well as quantitatively by inspecting the defective electrical properties of wiring formed on the board while controlling a secondary beam based on the image forming conditions for the secondary beam. SOLUTION: Image signals for respective measuring points supplied to an image signal processing section 58 are applied to an image formation determining section 62 via a predetermined signal process. The section 62 determines whether or not a secondary beam has formed an image properly at an electron detecting section based on each image signal. When having determined that the image is formed properly, the section 62 delivers the determination result to a measurement instructing section 64. In response to the determination result, the section 64 supplies image forming conditions therefor to a board surface potential calculating section 63, moves a stage to a next measuring point, injects an electron beam, and controls the secondary beam, thereby to inspect the defective electrical properties of wiring formed on the board.
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