发明名称 PHOTOSETTING RESIN COMPOSITION AND PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an aqueous development type photosetting resin composition capable of aqueous development and superior in the water and solvent resistances of the photosetting product having elasticity and to provide the pattern forming method using this composition. SOLUTION: This resin composition is obtained by reaction of reactants containing (a) polylactonediol, (b) diols selected from alkylenediol and polyalkylenediol and bisphenols or their hydrogenated alkyleneoxide adduct type diols, (c) polyisocyanate, and (d) compounds having ethylenically unsaturated groups, and further, an urethane compound having a carboxyl group in the molecule. The pattern is formed by using this photosetting resin composition to form a film and imagewise exposing it and removing the unexposed parts with an aqueous alkaline solution or an organic solvent containing an alkali or its mixture.
申请公布号 JP2000321764(A) 申请公布日期 2000.11.24
申请号 JP19990135100 申请日期 1999.05.17
申请人 HITACHI CHEM CO LTD 发明人 KAMITSURA MASAYOSHI;SHIODA MAKOTO
分类号 H05K3/06;C08G18/42;G03F7/027;G03F7/32 主分类号 H05K3/06
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