| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal core for a printed wiring board having excellent heat radiation, heat resistance after humid adsorption and the like with favorable workability at low cost in a printed wiring board having a metal core. SOLUTION: A clearance hole or slit is formed at a site other than where a semiconductor chip is mounted in a metal plate used to constitute a metal core. Subsequently, a metal core is formed by machining the semiconductor chip mounting site so that a plurality of protrusions in a truncated cone shape slightly taller than the metal core are provided on front and rear surfaces. Furthermore, a polyfunctional cyanate ester resin composite is used as a thermosetting resin composite. There can be provided a metal core for a printed wiring board for use in a semiconductor plastic package in a structure which is excellent in connection between the inner-layer metal core and the outer metal foil layer and heat radiation and suitable for mass production. Furthermore, there is provided a metal core with which a package excellent in properties such as electric insulation, anti-migration and the like after pressure cooking can be provided.
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