| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the chipping of terminal electrodes, impurity adhesion and chip packaging trouble by electronic corrosion which occur in the inspection by preventing the abutment of an inspection probe on the electrode pads to be packaged with the chip without using highly advanced technology necessary for the narrower pitch of the terminal electrodes. SOLUTION: The electrode pads 13 formed at the front ends of external terminal wiring 5 for press welding of input electrodes 12 of a semiconductor chip 6 are arranged on the flank side (the side shown by a length L1) of the semiconductor chip 6. Internal terminal wiring 2 extended from the respective electrode pads 3 for press bonding passes through the lower part of the semiconductor chip 6 in a state of the arrangement pitch of the electrode pads 3 and is formed to the outside of the chip packaging part. The respective electrode pads 4 for liquid crystal display inspection are arranged zigzag at the front ends of the extendedly formed internal terminal wiring 2. The zigzag arrangement of the electrode pads 4 may be divided to multiple stages of 3 or more stages.
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