SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

A semiconductor device comprises a semiconductor chip (10) with a plurality of electrodes; a first flexible substrate (20) having wiring patterns (22) and being larger than that side of the semiconductor chip (10) where the electrodes (12) are formed, the substrate carrying the semiconductor chip (10); a plurality of external terminals (38) connected electrically with the electrode (12) through the wiring patterns (22); and a second flexible substrate (30) attached to the first flexible substrate (20) while avoiding the semiconductor chip (10).