| 摘要 |
<p>A multimodal fluoroplastic terpolymer composition is provided. The terpolymer can be extruded at high extrusion speeds without having to reduce its molecular weight. The terpolymer is useful by itself; in combination with conductive fillers to provide an electrostatically dissipative composition; and as a polymer processing aid. The polymer has a low molecular weight component, a high molecular weight component and, optionally an ultra-high molecular weight component.</p> |
