Manufacture of carrier e.g. multifunctional chip card with display, involves covering base with flowable plastic material so that electronic components are partially embedded and processing upper side of plastics material

摘要

The method involves providing a base (20) with a planar surface and positioning at least one electronic component on it. The base is covered with a flowable plastics material such the components are at least partially embedded. The upper side of the plastics material is processed to form a carrier with a plane-parallel surface and predetermined thickness.