| 摘要 |
<p>A high density electronic package (100, 100'', 300, 300') includes a low-modulus-of-elasticity flexible adhesive interposer substrate (110, 210, 310, 330, 500) to which an electronic device, (120, 320, 620, 622, 624, 626) such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate (110, 210, 310, 330, 500) includes a sheet or layer (111, 211, 311, 331, 520, 530) of a molecularly flexible adhesive having via holes therein in which are built up conductive vias (112, 212, 312, 315, 335, 550, 618) to which contacts of the electronic device (120, 320, 620, 622, 624, 626) connect. A thin layer of metal foil (113, 213, 313, 510, 540) on one surface of the flexible adhesive sheet (111, 211, 311, 331, 520, 530) is patterned to provide contacts and to connect electrically to the conductive vias (112, 212, 312, 315, 335, 550, 618). The electronic device (120, 320, 620, 622, 624, 626) may be covered by a lid (130) or by an encapsulant (137) attached to the flexible adhesive interposer substrate (110, 210, 310, 330, 500) and/or the electronic device (120, 320, 620, 622, 624, 626). An electronic package (300) may include a plurality of electronic devices (320-1, 320-2, 320-3) and respective flexible adhesive interposers (310-1, 310-2, 310-3, 330-1, 330-2, 330-3) that are electrically interconnected.</p> |
