| 摘要 |
A polishing apparatus can strictly control the degree of material removal by providing close control over the operating temperature in the polishing table (12). The polishing apparatus has a polishing table (12) and a workpiece holder (14) for pressing a workpiece (W) towards the polishing table (12). The polishing table (12) has a polishing section (30) or a polishing tool attachment section at a surface thereof and a thermal medium passage (32) formed along the surface. The thermal medium passage (32) has a plurality of temperature adjustment passages provided respectively in a plurality of temperature adjustment regions which are formed by radially dividing a surface area of the polishing table (12). |
