| 摘要 |
radio electronic equipment. SUBSTANCE: material may be used in design of equipment using surface acoustic waves. Composite material of acoustic dampener contains epoxy low- molecular resin, which molecular weight is not greater than 400. Hardener is designed as low-molecular aliphatic polyamide, which molecular weight is not greater than 1000. filler is designed as silicon dioxide powder. Maximum of granulometric distribution of silicon dioxide grains is within range of lambda/4 and lambda/2, where lambda is wavelength of surface acoustic wave. Weight content of components in composite material is within range of 1.8-2.2 of epoxy low-molecular resin, 6.5-7.5 of low-molecular aliphatic polyamide, 1-1.5 of silicon dioxide. EFFECT: facilitated production of material, increased level of noise suppression. 1 tbl, 1 dwg
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