发明名称 DEVICE FOR TREATING WAFERS
摘要 The invention relates to a device for treating wafers in at least one clean room (3). The device comprises an arrangement of production units (1) for carrying out individual production steps, and measuring units (8, 9) for checking the production steps. Said production units and said measuring units are connected by a transport system for supplying and removing the wafers. Together with an output station for outputting wafers to the transport system, at least one measuring unit (8, 9) forms a measuring station (2). Correctly treated wafers can then be output from the measuring station (2) separately from the other wafers.
申请公布号 WO0068971(A2) 申请公布日期 2000.11.16
申请号 WO2000DE01450 申请日期 2000.05.05
申请人 INFINEON TECHNOLOGIES AG;GOETZKE, MICHAEL 发明人 GOETZKE, MICHAEL
分类号 H01L21/677;B65G49/07;H01L21/00;H01L21/673;(IPC1-7):H01L/ 主分类号 H01L21/677
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