| 摘要 |
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate member (10) which is substantially circular in transverse cross section, which is substantially inelastic in its longitudinal direction and which is elastic and deformable (compressible) in its radial direction. The tool has an inner core (12) which is substantially inelastic at least in its longitudinal direction surrounded by a cylindrical outer shell (14) which is elastic and deformable in its radial direction. Apparatus employing the tool comprises a first spool (30) upon which a length of said tool is wound, guide means for guiding said tool along a predetermined path from said first spool (30) to a second spool (32) may be wound, and drive means for driving said spools so as to drive the tool along said path between the spools, a portion of said path comprising a work station (33) at which a workpiece may be positioned to be operated on by said tool. The workstation (33) permits the wafer (W) to be translated and rotated relative to the tool to lap and/or polish the periphery of the wafer, including an orientation notch (40) formed therein. Methods of operation are also disclosed. |
