| 摘要 |
<p>An end-effector (200, 300, 400) with integrated cooling features comprises heat transferring mechanisms that transfer heat energy away from the end-effector. The end-effector advantageously minimizes the cooling overhead of a processed substrate as it is transported from a process module to a low-cost storage cassette. The reduced cooling overhead of the processed substrate, as a consequence, improves substrate throughput. In the preferred embodiments, the heat transferring mechanisms include a high surface area heat sink (110) connecting the substrate-supporting paddle (115) with a robot arm. Cooling fins (105) can enhance surface area and thus enhance heat dissipation from the heat sink. Cooling channels can extend through end-effector. In one embodiment, channels (305) extend through both the paddle (315) and handle portion (310), and containing circulating fluid for carrying heat beyond the end-effector (300). In another embodiment, channels (405) extend only through the heat sink (410), containing circulating fluid for carrying heat beyond the end-effector (400). In still another embodiment, channels (505) comprise heat pipes enclosing a phase changing material.</p> |
