| 摘要 |
Transponder circuitry is at least partially covered by carrier. Carrier is made of hot melt adhesive of polyamide. Transpond circuitry (2) is placed in lower mould, top mould put on and adhesive injected into mould at approximately 200 degrees C at low pressure of circa 20 bar. When adhesive solidifies, circuit is taken out. Independent claim included for procedure to manufacture transponder. |
