| 摘要 |
<p>A method for producing an electrical feedthru (10) wherein a thin liquid conductive film is deposited into a shallow trough (12) of an insulating machinable substrate (14). The conductive film and substrate (14) are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate (14). The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create a low leakage barrier capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope (P1, P2). The resulting electrical trace (16) can be soldered directly to a signal carrying wire, pin/socket, or attached via a contact spring or other mechanical attachment. No epoxies are used, thus avoiding thermal limitations and outgassing contamination.</p> |
