SEMICONDUCTOR DEVICES WITH IMPROVED LEAD FRAME STRUCTURES

摘要

A lead frame to support a semiconductor die within an encapsulating package. The lead frame includes a first rail and a second rail in a first plane, with the second rail parallel to and spaced apart from the fist rail by more than the length of the package. A first bar and a second bar are connected perpendicularly to the first and second rails, with the second bar space apart from the first bar by more than the width of the package. A lead is connected perpendicularly to the first bar with an unconnected lead end extending toward the second bar and located to extend under the supported semiconductor die. A first support tab is connected perpendicularly to the first rail with a first unconnected tab end extending toward the second rail and located to extend under the supported semiconductor die. A second support tab is connected perpendicularly to the second rail with a second unconnected tab end extending toward the first rail and located to extend under the supported semiconductor die.