| 摘要 |
<p>The present invention provides a plating apparatus having a plating section and a control section, in which plating and control sections are installed in separate rooms, such that maintenance work generating contamination is performed as much as possible in the room housing the control section, thereby minimizing maintenance work on the plating section and preventing contamination being generated therefrom. The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room separate from the first room. <IMAGE></p> |
