Method for chemical mechanical planarization

摘要

A semiconductor substrate processing system for polishing a substrate that generally includes a platen (10,12) and a web (1104) of polishing material disposed thereon. Embodiments of the system include a disposable cartridge (1002) for housing the web of polishing material, a shield member (256) disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery system (184,186) for fixing and freeing the web from the platen, apparatus (1402) for controlling the lateral movement of the web, and an apparatus (304,306) for providing more linear feet of polishing material per height of a roll.