| 摘要 |
<p>PURPOSE: A method for calibrating a bonding pressure of a capillary for a wire bonding is provided to directly measure a bonding pressure in the same dynamic state as in a real bonding process. CONSTITUTION: A capillary(22) is transferred to a piezo-electric element(25). The capillary is driven to pressurize the piezo-electric element while varying an input value until a predetermined first output value is measured from the piezo-electric element. And, a first input value is detected when the first output value is measured. The capillary is driven to pressurize the piezo-electric element while varying an input value until a predetermined second output value is measured from the piezo-electric element. And, a second input value is detected when the second output value is measured. A ratio of the input value variation to the output value variation is computed using the first and second input values and the first and second output values.</p> |
