发明名称 ALLOY PLATING
摘要 There is disclosed an electroplating bath for depositing zinc/manganese alloys on a substrate characterized in that it comprises an aqueous bath free or substantially free of ammonium halide and of fluoroborate which is made up from 10-150 g/l, alkali metal salt, 30-90 g/l boric acid, 10-200 g/l water soluble zinc salt, 10-50 g/l water soluble manganese salt, 60-140 g/l alkali metal gluconate or tartrate and a base e.g. an alkali metal hydroxide to bring the pH to the range 6.1-7.1. Passivates are also disclosed.
申请公布号 WO0068464(A2) 申请公布日期 2000.11.16
申请号 WO2000GB01703 申请日期 2000.05.04
申请人 ENTHONE-OMI INC.;KEARNEY, KEVIN, DAVID, NICHOLAS;VERBERNE, WILHEMUS, MARIA, JOHANNES, CORNELIS 发明人 VERBERNE, WILHEMUS, MARIA, JOHANNES, CORNELIS
分类号 C23C22/27;C25D3/56;C25D5/26;(IPC1-7):C25D3/56 主分类号 C23C22/27
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