MULTI-LAYER TYPE TBGA SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A multi-layer type TBGA(Tab Ball Grid Array) semiconductor package and a method for manufacturing the same are provided to simplify a complicated circuit structure by performing the multi-layer of a circuit pattern. CONSTITUTION: A multi-layer type TBGA semiconductor package and a method for manufacturing the same comprise a radiation fin(22), two or more TAB tapes(23), a conductive paste, a semiconductor chip, and a solder ball. The TAB tapes are accumulated on the radiation fin. The TAB tapes comprise a penetration hole on a predetermined area. The conductive paste connects electrically circuit patterns of TAB tapes of each layer. The semiconductor chip is adhered on the radiation fin. The solder ball is adhered on the circuit pattern of the highest layer of the accumulated TAB tapes.