| 摘要 |
PURPOSE: A ball grid array(BGA) semiconductor package is provided to decrease manufacturing cost, by obviating the necessity of an additional unit for precise alignment when a conductive ball is placed on a substrate for packaging. CONSTITUTION: A semiconductor chip(91) is adhered to a recess(53) formed in the center of a lower substrate(51). A wire(93) connects one end of an interconnection(59) formed on the upper surface of the lower substrate with the semiconductor chip. An encapsulating member(97) surrounds the upper surface of the recess, the wire and the semiconductor chip. A lower penetration hole(55) of which the upper portion is broader than the lower portion, is formed in the outside of the recess. A conductive ball is disposed in the lower penetration hole. An upper penetration hole(75) of which the upper portion is narrower than the lower portion, is formed in a position corresponding to the conductive ball. An upper substrate(71) having the upper penetration hole is adhered to the lower substrate. |
