发明名称 SPUTTERING DEVICE
摘要 PURPOSE: A novel type sputtering device is provided to prevent the corrosion of a specific portion of a metal target. CONSTITUTION: A magnet(228) for applying a certain electric force on a metal target and placed on a base plate(204) is connected with an elastic member(spring)(230) to move in radial on the base plate along a recessed face(226) formed in a certain size and width. When the base plate rotates, the magnet moves toward the circumference of the base plate by the centrifugal force. The magnetic field formed by the moving magnet is movable. According to the formation of the electromagnetic field, plasma of high density is created.
申请公布号 KR20000065829(A) 申请公布日期 2000.11.15
申请号 KR19990012529 申请日期 1999.04.09
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 KIM, TAE GYUN
分类号 C23C14/35;(IPC1-7):C23C14/35 主分类号 C23C14/35
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