发明名称 |
METHOD OF FORMING A CAPACITOR OF A SEMICONDUCTOR MEMORY DEVICE |
摘要 |
PURPOSE: A capacitor forming method of a semiconductor memory device is provided to prevent a silicon cluster of connecting adjacent storage electrodes by flowing hydrogen gas on an entire surface of a semiconductor substrate together with source gas injection. CONSTITUTION: A capacitor forming method of a semiconductor memory device comprises forming an interlayer insulation film(100) over a P-type semiconductor substrate, on which an access transistor is formed. An amorphous silicon pattern(102) for a storage electrode, which is connected to a diffusion region of the access transistor via a contact plug, is formed on an entire surface of a resultant structure. Hydrogen gas(104) flows on an entire surface of a resultant structure.
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申请公布号 |
KR20000066731(A) |
申请公布日期 |
2000.11.15 |
申请号 |
KR19990014034 |
申请日期 |
1999.04.20 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
LIM, EUN TAEK |
分类号 |
H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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