发明名称 METHOD OF FORMING A CAPACITOR OF A SEMICONDUCTOR MEMORY DEVICE
摘要 PURPOSE: A capacitor forming method of a semiconductor memory device is provided to prevent a silicon cluster of connecting adjacent storage electrodes by flowing hydrogen gas on an entire surface of a semiconductor substrate together with source gas injection. CONSTITUTION: A capacitor forming method of a semiconductor memory device comprises forming an interlayer insulation film(100) over a P-type semiconductor substrate, on which an access transistor is formed. An amorphous silicon pattern(102) for a storage electrode, which is connected to a diffusion region of the access transistor via a contact plug, is formed on an entire surface of a resultant structure. Hydrogen gas(104) flows on an entire surface of a resultant structure.
申请公布号 KR20000066731(A) 申请公布日期 2000.11.15
申请号 KR19990014034 申请日期 1999.04.20
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 LIM, EUN TAEK
分类号 H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/108
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