LAMINATED TYPE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD FOR SEMICONDUCTOR PACKAGE AND LAMINATION METHOD THEREOF

摘要

PURPOSE: A stacked type semiconductor package is provided to increase mounting density by stacking semiconductor packages, and to be used in a package having a high process speed by adhering a heat radiation plate and easily adhering an additional heat radiation plate. CONSTITUTION: A via hole is formed in a printed circuit board(PCB), and a circuit is formed on the upper surface of the PCB. A chip is inserted into the PCB. A wire electrically connects the chip with an inner lead of the PCB. A molding part covers a predetermined surface including the chip and the wire. A heat radiation metal plate is adhered to the lower surface of the PCB. A hole having a diameter larger than that of the via hole is formed, corresponding to the via hole. The via hole penetrates the PCB and the heat radiation metal plate. The inside wall of the via hole is plated. A metal pin is inserted into the via hole, and becomes an external terminal.