ADHESIVE FOR ELECTROLESS PLATING, RAW MATERIAL COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING AND PRINTED WIRING BOARD

摘要

The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 mu m, and comprised of rough particles and fine particles. <IMAGE>