| 摘要 |
PROBLEM TO BE SOLVED: To provide an enclosure for an audio speaker assembly in an automotive door. SOLUTION: A door module 30 to be assembled into an automotive door has an inside space, inner and outer walls 36 and 38 facing with each other and nearly vertical, front and rear walls 40 and 42 facing with each other and nearly vertical, and a hollow enclosure 32 firm as the whole having nearly horizontal bottom and upper part walls 44 and 46 (46H and 46I). The enclosure 32 is constituted so as to make the wall 46 be changed gradually from the nearly horizontal portion 46H nearby the wall 42 to the nearly slant portion 46I nearby the wall 40. The wall 36 includes a hole 48 into which an audio speaker assembly such as a sub wafer is housed in order to receive the assembly in a sealed condition.
|
