发明名称 |
Multi-chip module having printed wiring board comprising circuit pattern for IC chip |
摘要 |
PCT No. PCT/JP94/01517 Sec. 371 Date Jun. 13, 1996 Sec. 102(e) Date Jun. 13, 1996 PCT Filed Sep. 14, 1994 PCT Pub. No. WO95/08189 PCT Pub. Date Mar. 23, 1995Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board. Lead pads (107) and the outer electrode pads (105) are interconnected through a circuit pattern (109), through holes (111) and interstitial via holes (112). The circuit pattern (109) is disposed on a die bonding surface of the bare IC chips (201 and 202) for which insulation is not necessary. A multi-chip module is thus completed.
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申请公布号 |
US6147876(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19960617843 |
申请日期 |
1996.06.13 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMAGUCHI, MASAYOSHI;SAWANO, MITSUTOSHI;HOHKI, KAZUTOSHI |
分类号 |
H01L25/18;H01L21/98;H01L23/24;H01L23/538;H01L25/04;H01L25/065;H01L25/16;H05K1/14;H05K3/34;H05K3/36;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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