Power semiconductor module

摘要

A power semiconductor module includes a lead frame, at least one power semiconductor component fastened on said lead frame, a housing at least partly encapsulating said power semiconductor component, a plurality of output lines electrically conductively connected to said power semiconductor component and including load current-carrying output lines, electrically conductive connections between said at least one power semiconductor component and at least said load current-carrying output lines, and an interrupter. The interrupter irreversibly interrupts at least said load current-carrying output lines and/or said electrically conductive connections and at least said load current-carrying output lines, if the temperature of said power semiconductor component exceeds a predetermined temperature threshold. The interrupter is formed of a material having a volume-expanding and/or an oxidizing and/or an explosive characteristic with an increasing temperature.