| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the occurrence of package cracking, etc., caused by a popcorn phenomenon and internal stress relief which occur in a reflowing process, by preparing an adhesive composition used for a semiconductor device by mixing an epoxy resin, an epoxy curing agent, an elastic material, and silane coupling agent with each other. SOLUTION: An adhesive composition used for a semiconductor device in which a reinforcing member is laminated upon the circuit surface or rear surface of a substrate for IC composed at least of an insulating layer and a conductor circuit is prepared by mixing (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic material, and (d) a silane coupling agent with each other. The (a) epoxy resin has two or more oxirane rings and the concrete example of the resin includes glycidyl ether, linear aliphatic epoxide, etc. The (b) epoxy curing agent is a chemical material that forms a tree-dimensional network structure by reacting to the epoxy resin and the concrete example of the (c) elastic material includes a resin called elastomer.
|
